Development of a compact thermal model for electronic package

In this paper the process of generating the boundary conditions independent static compact thermal model (BCI-CTM) from the detailed model simulation was investigated. The static CTM consisting of resistor network based on the proposed method by DELPHI was defined. For the BGA package the topology of the network was determined which has seven resistors connecting the nodes of network. An algorithm has been developed in MATLAB to calculate the proper values for the resistors. These values are optimized by a cost function and optimization algorithm. Validation of the generated static CTM showed that it has good performance and meets the available criterion. Although DELPHI CTM has not become commonly used in thermal design but it could be a typical standardized modeling for 3D future package [1]. This study presents in it future work a proposal to customize the CTM to both the simplicity and accuracy that deemed by the package consumers.