Title :
Noise - its sources, and impact on design and test of mixed signal circuits
Author_Institution :
Ample Commun. Inc., Sacramento, CA, USA
Abstract :
Technology shrinkage has enabled the integration of multi million devices on silicon. This integration in digital and analog functionality is challenging since we now have to consider electrical effects that were not an issue with older process technologies. Communication systems, especially ICs targeted at SONET systems, have to operate at very large data rates. Nowadays ICs with data rates greater that 3.125 giga bits per second (Gbps) are being designed. At these data rates, noise sources, coupling effects, and package parasitics need to be extremely well understood since these impact the design, test and characterization of devices. This paper will present a discussion on various sources of noise, provide an understanding for the package models, and how this can impact test and characterization
Keywords :
integrated circuit modelling; integrated circuit noise; integrated circuit packaging; integrated circuit technology; integrated circuit testing; mixed analogue-digital integrated circuits; 3.125 Gbit/s; characterization; communication systems; coupling effects; electrical effects; mixed signal circuits; noise sources; package models; package parasitics; process technologies; Circuit noise; Circuit testing; Integrated circuit noise; Packaging; Semiconductor device noise; Semiconductor diodes; Signal design; Substrates; Thermal resistance; White noise;
Conference_Titel :
Electronic Design, Test and Applications, 2002. Proceedings. The First IEEE International Workshop on
Conference_Location :
Christchurch
Print_ISBN :
0-7695-1453-7
DOI :
10.1109/DELTA.2002.994652
