• DocumentCode
    2402850
  • Title

    Impact of process variability on universal gates

  • Author

    Saonwani, Manohar ; Khanna, Gargi ; Chandel, Rajeevan

  • Author_Institution
    Electron. & Commun. Eng. Dept., NIT, Hamirpur, India
  • fYear
    2012
  • fDate
    15-17 March 2012
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The exponential growth in the ULSI technology is due to scaling but the certainity in the performance of chips is reducing in nano scale regime. The process variation is growing as a major concern and thus need to be analysed necessarily below sub micron regime. In this paper, the effect of process induced parameter variation on the delay of universal gate is analysed. Device variations fluctuations in MOS parameters viz. effective gate length (Leff), threshold voltage (Vth), thickness of the gate oxide (tox), and the drain/source region parasitic resistance (Rdsw) are considered in this work. The analysis is done with Monte Carlo method using T-SPICE for various technologies. The comparisons of the results show that process variations become important in deep sub micron regime and increase the uncertainity in speed.
  • Keywords
    MOS integrated circuits; Monte Carlo methods; SPICE; logic gates; MOS parameter; Monte Carlo method; T-SPICE; ULSI technology; chip performance; device variation fluctuation; drain/source region parasitic resistance; exponential growth; gate length; gate oxide thickness; nano scale regime; process induced parameter variation; process variability; submicron regime; threshold voltage; universal logic gate; Delay; Logic gates; Monte Carlo methods; Performance evaluation; Resistance; Standards; Threshold voltage; T-SPICE; Universal logic gate; device parameter; mean; monte-carlo; standard deviation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Processing, Computing and Control (ISPCC), 2012 IEEE International Conference on
  • Conference_Location
    Waknaghat Solan
  • Print_ISBN
    978-1-4673-1317-9
  • Type

    conf

  • DOI
    10.1109/ISPCC.2012.6224383
  • Filename
    6224383