DocumentCode :
2402850
Title :
Impact of process variability on universal gates
Author :
Saonwani, Manohar ; Khanna, Gargi ; Chandel, Rajeevan
Author_Institution :
Electron. & Commun. Eng. Dept., NIT, Hamirpur, India
fYear :
2012
fDate :
15-17 March 2012
Firstpage :
1
Lastpage :
6
Abstract :
The exponential growth in the ULSI technology is due to scaling but the certainity in the performance of chips is reducing in nano scale regime. The process variation is growing as a major concern and thus need to be analysed necessarily below sub micron regime. In this paper, the effect of process induced parameter variation on the delay of universal gate is analysed. Device variations fluctuations in MOS parameters viz. effective gate length (Leff), threshold voltage (Vth), thickness of the gate oxide (tox), and the drain/source region parasitic resistance (Rdsw) are considered in this work. The analysis is done with Monte Carlo method using T-SPICE for various technologies. The comparisons of the results show that process variations become important in deep sub micron regime and increase the uncertainity in speed.
Keywords :
MOS integrated circuits; Monte Carlo methods; SPICE; logic gates; MOS parameter; Monte Carlo method; T-SPICE; ULSI technology; chip performance; device variation fluctuation; drain/source region parasitic resistance; exponential growth; gate length; gate oxide thickness; nano scale regime; process induced parameter variation; process variability; submicron regime; threshold voltage; universal logic gate; Delay; Logic gates; Monte Carlo methods; Performance evaluation; Resistance; Standards; Threshold voltage; T-SPICE; Universal logic gate; device parameter; mean; monte-carlo; standard deviation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Processing, Computing and Control (ISPCC), 2012 IEEE International Conference on
Conference_Location :
Waknaghat Solan
Print_ISBN :
978-1-4673-1317-9
Type :
conf
DOI :
10.1109/ISPCC.2012.6224383
Filename :
6224383
Link To Document :
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