Title :
Broadband low-loss interconnects enabled by photonic wire bonding
Author :
Lindenmann, N. ; Balthasar, G. ; Leuthold, J. ; Freude, W. ; Koos, C.
Author_Institution :
Inst. of Photonics & Quantum Electron. (IPQ), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
Abstract :
Low-loss photonic wire bonds (PWB) enable inter-chip connections with average losses of 1.6 dB in the whole C-band. The underlying technique allows for flexible automatic fabrication of single-mode chip-to-chip interconnects.
Keywords :
lead bonding; optical fabrication; optical interconnections; automatic fabrication; broadband low loss interconnects; interchip connections; loss 1.6 dB; photonic wire bonding; single mode chip-to-chip interconnects; Fabrication; Optical losses; Optical waveguides; Photonics; Polymers; Wires;
Conference_Titel :
Optical Interconnects Conference, 2012 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4577-1620-1
DOI :
10.1109/OIC.2012.6224414
