• DocumentCode
    2403407
  • Title

    Broadband low-loss interconnects enabled by photonic wire bonding

  • Author

    Lindenmann, N. ; Balthasar, G. ; Leuthold, J. ; Freude, W. ; Koos, C.

  • Author_Institution
    Inst. of Photonics & Quantum Electron. (IPQ), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
  • fYear
    2012
  • fDate
    20-23 May 2012
  • Firstpage
    125
  • Lastpage
    126
  • Abstract
    Low-loss photonic wire bonds (PWB) enable inter-chip connections with average losses of 1.6 dB in the whole C-band. The underlying technique allows for flexible automatic fabrication of single-mode chip-to-chip interconnects.
  • Keywords
    lead bonding; optical fabrication; optical interconnections; automatic fabrication; broadband low loss interconnects; interchip connections; loss 1.6 dB; photonic wire bonding; single mode chip-to-chip interconnects; Fabrication; Optical losses; Optical waveguides; Photonics; Polymers; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Interconnects Conference, 2012 IEEE
  • Conference_Location
    Santa Fe, NM
  • Print_ISBN
    978-1-4577-1620-1
  • Type

    conf

  • DOI
    10.1109/OIC.2012.6224414
  • Filename
    6224414
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2403407