Title :
Reliability of the 3-D computer under stress of mechanical vibration and thermal cycling
Author :
Kallis, J.M. ; Duncan, L.B. ; Laub, S.P. ; Little, M.J. ; Miani, L.M. ; Sandkulla, D.C.
Author_Institution :
Hughes Aircraft Co., El Segundo, CA, USA
Abstract :
An assessment of the mechanical reliability of the 3-D Computer is presented. The purpose of this reliability assessment was to gain confidence in the feasibility of this stacked-wafer approach for space-based applications. The investigation addressed both the mechanical and thermal reliability by means of analyses and experiments
Keywords :
VLSI; cellular arrays; circuit reliability; microprocessor chips; parallel processing; 3-D computer; mechanical reliability; mechanical vibration; space-based applications; stacked-wafer approach; thermal cycling; thermal reliability; Aircraft; Application software; Assembly; Concurrent computing; Integrated circuit interconnections; Laboratories; Microelectronics; Signal processing; Thermal stresses; Vibrations;
Conference_Titel :
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9901-9
DOI :
10.1109/WAFER.1989.47537
