Title :
Title: Through Silicon Via (TSV) technology creates electro-optical interfaces
Author_Institution :
ALLVIA, Inc
Abstract :
Through Silicon Via (TSV) technology is emerging as an essential method for stacking and interconnecting semiconductor chips. Much has been reported about the interconnecting and stacking of devices, such as, memory-on-memory and memory-on-logic devices. TSV fabrication is a micro-machining process for silicon. As such it can also be utilized to etch and form structures other than vias. One such structure is an electro-optical interposer using TSVs and fiberoptic channels. The performance of this structure has been tested to over 10 Gb/sec.
Keywords :
electro-optical devices; micromachining; silicon; vias; Si; TSV; bit rate 10 Gbit/s; electrooptical interposer; fiberoptic channels; micromachining; through silicon via technology; Mirrors; Optical fiber devices; Optical fibers; Receivers; Silicon; Through-silicon vias; Vertical cavity surface emitting lasers;
Conference_Titel :
Optical Interconnects Conference, 2012 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4577-1620-1
DOI :
10.1109/OIC.2012.6224436
