DocumentCode :
2404053
Title :
Recent progress on 3-D integrated intra-chip free-space optical interconnect
Author :
Ciftcioglu, Berkehan ; Gao, Jing ; Berman, Rebecca ; Jain, Manish ; Moore, Duncan ; Wicks, Gary ; Huang, Michael ; Friedman, Eby G. ; Wu, Hui
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA
fYear :
2012
fDate :
20-23 May 2012
Firstpage :
56
Lastpage :
57
Abstract :
In this paper, the authors compare the energy efficiency of a WDM-based optical interconnect similar to and the proposed intra-chip free-space optical interconnect FSOI system to illustrate the advantages of the approach. The operation wavelength of the WDM-based systems is chosen to be 1550 nm, while the FSOI system still uses 980 nm. To emphasize the effects of photonic devices and optics design, the transceiver circuits is excluded from the calculation, which would be similar in both cases. To simplify the calculation, the PDs in both systems are assumed to have 100% quantum efficiency and adequate bandwidth to support 10-Gbps data rate, which gives the WDM system unfair advantage.
Keywords :
integrated optics; optical interconnections; optical links; wavelength division multiplexing; 3-D integrated intrachip free-space optical interconnect; FSOI; WDM; quantum efficiency; Bandwidth; Gallium arsenide; Optical device fabrication; Optical interconnections; Optical losses; Vertical cavity surface emitting lasers; Wavelength division multiplexing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Interconnects Conference, 2012 IEEE
Conference_Location :
Santa Fe, NM
Print_ISBN :
978-1-4577-1620-1
Type :
conf
DOI :
10.1109/OIC.2012.6224449
Filename :
6224449
Link To Document :
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