• DocumentCode
    2404053
  • Title

    Recent progress on 3-D integrated intra-chip free-space optical interconnect

  • Author

    Ciftcioglu, Berkehan ; Gao, Jing ; Berman, Rebecca ; Jain, Manish ; Moore, Duncan ; Wicks, Gary ; Huang, Michael ; Friedman, Eby G. ; Wu, Hui

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA
  • fYear
    2012
  • fDate
    20-23 May 2012
  • Firstpage
    56
  • Lastpage
    57
  • Abstract
    In this paper, the authors compare the energy efficiency of a WDM-based optical interconnect similar to and the proposed intra-chip free-space optical interconnect FSOI system to illustrate the advantages of the approach. The operation wavelength of the WDM-based systems is chosen to be 1550 nm, while the FSOI system still uses 980 nm. To emphasize the effects of photonic devices and optics design, the transceiver circuits is excluded from the calculation, which would be similar in both cases. To simplify the calculation, the PDs in both systems are assumed to have 100% quantum efficiency and adequate bandwidth to support 10-Gbps data rate, which gives the WDM system unfair advantage.
  • Keywords
    integrated optics; optical interconnections; optical links; wavelength division multiplexing; 3-D integrated intrachip free-space optical interconnect; FSOI; WDM; quantum efficiency; Bandwidth; Gallium arsenide; Optical device fabrication; Optical interconnections; Optical losses; Vertical cavity surface emitting lasers; Wavelength division multiplexing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Interconnects Conference, 2012 IEEE
  • Conference_Location
    Santa Fe, NM
  • Print_ISBN
    978-1-4577-1620-1
  • Type

    conf

  • DOI
    10.1109/OIC.2012.6224449
  • Filename
    6224449