DocumentCode
2404144
Title
Flip-chip power distribution
Author
Lipa, S. ; Schaffer, J.T. ; Glaser, A.W. ; Franzon, P.D.
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
1998
fDate
26-28 Oct 1998
Firstpage
39
Lastpage
41
Abstract
By using thin-film (MCM-D) and flip-chip solder bump technologies to distribute power and ground to an IC, the percentage of metal fill required on the power and ground layers can be reduced. However, significant reductions require a very dense solder bump technology
Keywords
flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; microassembling; multichip modules; soldering; IC power/ground distribution; dense solder bump technology; flip-chip power distribution; flip-chip solder bump technology; ground layers; metal fill percentage; power layers; thin-film MCM-D technology; CMOS process; CMOS technology; Cryptography; Current density; Integrated circuit noise; Noise level; Power distribution; Process design; Substrates; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.733745
Filename
733745
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