Title :
Flip-chip power distribution
Author :
Lipa, S. ; Schaffer, J.T. ; Glaser, A.W. ; Franzon, P.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
By using thin-film (MCM-D) and flip-chip solder bump technologies to distribute power and ground to an IC, the percentage of metal fill required on the power and ground layers can be reduced. However, significant reductions require a very dense solder bump technology
Keywords :
flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; microassembling; multichip modules; soldering; IC power/ground distribution; dense solder bump technology; flip-chip power distribution; flip-chip solder bump technology; ground layers; metal fill percentage; power layers; thin-film MCM-D technology; CMOS process; CMOS technology; Cryptography; Current density; Integrated circuit noise; Noise level; Power distribution; Process design; Substrates; Transistors;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733745
