DocumentCode :
2404170
Title :
National Institute of Standards and Technology programs in electrical measurements for electronic interconnections
Author :
DeGroot, Donald C. ; Williams, Dylan F.
Author_Institution :
Div. of Radio Frequency Technol., Nat. Inst. of Stand. & Technol., Boulder, CO, USA
fYear :
1998
fDate :
26-28 Oct 1998
Firstpage :
45
Lastpage :
49
Abstract :
The National Institute of Standards and Technology operates a number of research projects to advance measurement science and technology for the microelectronic industries. We report here on one component of the NIST program, the fundamental electrical characterization of electronic interconnections through accurate measurement. We have developed and continue to develop measurement techniques for fully calibrated time-domain network analysis, lossy transmission lines on silicon, coupled transmission lines, fully calibrated multiport network analysis, low dielectric constant thin-film materials, and at-speed test
Keywords :
calibration; coupled transmission lines; dielectric thin films; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit testing; measurement standards; multiport networks; network analysis; permittivity; time-domain analysis; NIST program; National Institute of Standards and Technology; National Institute of Standards and Technology programs; at-speed test; calibrated multiport network analysis; calibrated time-domain network analysis; coupled transmission lines; electrical measurements; electronic interconnections; fundamental electrical characterization; lossy transmission lines; low dielectric constant thin-film materials; measurement science; measurement techniques; measurement technology; research projects; silicon substrate; Dielectric loss measurement; Dielectric measurements; Electric variables measurement; Measurement techniques; Microelectronics; NIST; Propagation losses; Silicon; Time domain analysis; Transmission line measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
Type :
conf
DOI :
10.1109/EPEP.1998.733747
Filename :
733747
Link To Document :
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