National Institute of Standards and Technology programs in electrical measurements for electronic interconnections

Author

DeGroot, Donald C. ; Williams, Dylan F.

Author_Institution

Div. of Radio Frequency Technol., Nat. Inst. of Stand. & Technol., Boulder, CO, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

45

Lastpage

49

Abstract

The National Institute of Standards and Technology operates a number of research projects to advance measurement science and technology for the microelectronic industries. We report here on one component of the NIST program, the fundamental electrical characterization of electronic interconnections through accurate measurement. We have developed and continue to develop measurement techniques for fully calibrated time-domain network analysis, lossy transmission lines on silicon, coupled transmission lines, fully calibrated multiport network analysis, low dielectric constant thin-film materials, and at-speed test

Keywords

calibration; coupled transmission lines; dielectric thin films; integrated circuit interconnections; integrated circuit measurement; integrated circuit metallisation; integrated circuit testing; measurement standards; multiport networks; network analysis; permittivity; time-domain analysis; NIST program; National Institute of Standards and Technology; National Institute of Standards and Technology programs; at-speed test; calibrated multiport network analysis; calibrated time-domain network analysis; coupled transmission lines; electrical measurements; electronic interconnections; fundamental electrical characterization; lossy transmission lines; low dielectric constant thin-film materials; measurement science; measurement techniques; measurement technology; research projects; silicon substrate; Dielectric loss measurement; Dielectric measurements; Electric variables measurement; Measurement techniques; Microelectronics; NIST; Propagation losses; Silicon; Time domain analysis; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733747

Filename

733747