Title :
Inductance measurement of lead-frame packages
Author :
Shi, Weimin ; Fang, Jiayuan ; Yin, Ming
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
In the inductance measurement of lead-frame packages, according to the EIA/JEP123 Guideline, when the direct connection from the die-attach pad to the ground cannot be provided, the remote half of the leads are connected to ground to provide a low inductance current return path. In this paper, it is demonstrated through numerical simulations that this measurement set-up can introduce a considerable degree of error, especially for mutual inductance measurement. A new method is proposed to increase the accuracy of the measurement, and the effectiveness of the method is demonstrated by numerical simulation with FastHenry
Keywords :
circuit analysis computing; earthing; error analysis; inductance measurement; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; measurement errors; microassembling; numerical analysis; EIA/JEP123 Guideline; FastHenry numerical simulation; die-attach pad-ground connection; inductance measurement; lead-frame packages; low inductance current return path; measurement error; measurement method; measurement set-up; mutual inductance measurement; numerical simulation; remote lead grounding; Circuits; Conductivity measurement; Current measurement; Electronics packaging; Error correction; Guidelines; Inductance measurement; Measurement standards; Numerical simulation; Voltage measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733748
