Inductance measurement of lead-frame packages

Author

Shi, Weimin ; Fang, Jiayuan ; Yin, Ming

Author_Institution

Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

50

Lastpage

53

Abstract

In the inductance measurement of lead-frame packages, according to the EIA/JEP123 Guideline, when the direct connection from the die-attach pad to the ground cannot be provided, the remote half of the leads are connected to ground to provide a low inductance current return path. In this paper, it is demonstrated through numerical simulations that this measurement set-up can introduce a considerable degree of error, especially for mutual inductance measurement. A new method is proposed to increase the accuracy of the measurement, and the effectiveness of the method is demonstrated by numerical simulation with FastHenry

Keywords

circuit analysis computing; earthing; error analysis; inductance measurement; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; measurement errors; microassembling; numerical analysis; EIA/JEP123 Guideline; FastHenry numerical simulation; die-attach pad-ground connection; inductance measurement; lead-frame packages; low inductance current return path; measurement error; measurement method; measurement set-up; mutual inductance measurement; numerical simulation; remote lead grounding; Circuits; Conductivity measurement; Current measurement; Electronics packaging; Error correction; Guidelines; Inductance measurement; Measurement standards; Numerical simulation; Voltage measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.733748

Filename

733748