Title :
Applications for GaAs and silicon ICs in next generation wireless communication systems
Author_Institution :
3Com Corp., Santa Clara, CA, USA
Abstract :
Emerging applications for portable wireless voice and data communications systems are requiring increased data rates and functionality. Meeting cost and performance goals requires careful attention to system level design and partitioning such that appropriate technologies are employed in cost-effective solutions. New circuit designs and techniques are required to meet size, power, and regulatory restrictions. This provides an exciting opportunity for GaAs, silicon and other technologies. This paper will present several system level architectures for present and proposed radio-based communication systems. The paper will address requirements driving the technologies and appropriate applications of GaAs and silicon integrated circuit technologies.
Keywords :
data communication; demodulation; integrated circuit technology; land mobile radio; mobile radio; modulation; monolithic integrated circuits; voice communication; GaAs; Si; circuit designs; data communication; integrated circuit technologies; next generation wireless communication systems; partitioning; portable wireless communications; radio-based communication systems; system level architectures; system level design; voice communication; Appropriate technology; Circuit synthesis; Costs; Data communication; Gallium arsenide; Integrated circuit technology; Paper technology; Silicon; System-level design; Wireless communication;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1994. Technical Digest 1994., 16th Annual
Conference_Location :
Phildelphia, PA, USA
Print_ISBN :
0-7803-1975-3
DOI :
10.1109/GAAS.1994.636956