DocumentCode
2404636
Title
Automated high-frequency sealing in measuring instruments
Author
Schweizer, M.A. ; Spingler, J.C. ; Woessner, J.F.
Author_Institution
Fraunhofer-Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
Volume
3
fYear
1996
fDate
5-10 Aug 1996
Firstpage
1447
Abstract
During the assembly of measuring instruments, most different frame parts have to be preassembled and screwed together. Separation points of the casing have to be tipped with electrically conductive high frequency sealing. In the described application, the planning started with the design for assembly. Each component was analyzed to minimize the number of process risks. Considering the product structure, all assembly steps were layed down. One of the most important requirements was to assemble more than 20 different cases without any setup time. The result of the planning operations was the layout and technical concepts for all necessary tools and devices. By supervision of all processes, which are relevant for quality, it can be guaranteed that only good parts are assembled. One of the technically most interesting automation potentials was assembling high frequency sealing. Nonrigid seals with various diameters provided on rolls have to be joined in differently running slots. Additionally, adhesive spots have to be placed on the bottom of the slot. Because of complex assembly tasks, it is necessary to use an industrial robot with six axes. All handling operations in the assembly cell are lead by the robot
Keywords
assembling; industrial robots; instruments; large-scale systems; process control; robots; seals (stoppers); complex assembly tasks; design for assembly; high-frequency sealing automation; measuring instruments assembly; nonrigid seals; process risks; quality; six-axis industrial robot; Assembly systems; Frequency measurement; Instruments; Joining processes; Manufacturing automation; Risk analysis; Robotic assembly; Robotics and automation; Seals; Service robots;
fLanguage
English
Publisher
ieee
Conference_Titel
Industrial Electronics, Control, and Instrumentation, 1996., Proceedings of the 1996 IEEE IECON 22nd International Conference on
Conference_Location
Taipei
Print_ISBN
0-7803-2775-6
Type
conf
DOI
10.1109/IECON.1996.570596
Filename
570596
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