Author :
Augendre, E. ; Fedeli, J.M. ; Bordel, D. ; Ben Bakir, B. ; Kopp, C. ; Grenouillet, L. ; Hartmann, J.-M. ; Harduin, J. ; Philippe, P. ; Olivier, N. ; Fournier, M. ; Zussy, M. ; Lefebvre, K. ; Sturm, J. ; Cioccio, L. Di ; Fulbert, L. ; Clavelier, L.
Author_Institution :
LETI, CEA, Grenoble, France
Abstract :
In this paper, we discuss the requirements of direct bonding and show how it can provide photonic electronic integrated circuits including surface grating couplers, Ge photodiodes and energy-efficient hybrid Si/III-V lasers.
Keywords :
elemental semiconductors; germanium; integrated optoelectronics; optical couplers; photodiodes; silicon; silicon compounds; silicon-on-insulator; Ge; Si-SiO2; direct bonding; energy-efficient hybrid lasers; photodiodes; photonic electronic integrated circuits; photonics; surface grating couplers; Bonding; Photodiodes; Photonics; Silicon; Substrates; Surface treatment;
