DocumentCode :
2405215
Title :
Feeding structures for packaged multifinger power transistors
Author :
Breitkreutz, B. ; Schmückle, F.J. ; Heinrich, W.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik (FBH), Berlin
fYear :
2007
fDate :
9-12 Oct. 2007
Firstpage :
146
Lastpage :
149
Abstract :
Power transistors consist of a large number of cells, which are fed by a long row of parallel bonding wires. All cells are to be operated synchronously in order to avoid output power degradation. When increasing the number of unit cells or the frequency this condition becomes more and more critical. This paper investigates the underlying effects and presents improvements of such feeding structures in the frequency range up to 10 GHz.
Keywords :
microwave power transistors; wires (electric); feeding structures; packaged multifinger power transistors; parallel bonding wires; Bonding; Connectors; Finite difference methods; Frequency; Microstrip; Packaging; Power generation; Power transistors; Surface impedance; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2007. European
Conference_Location :
Munich
Print_ISBN :
978-2-87487-001-9
Type :
conf
DOI :
10.1109/EUMC.2007.4405147
Filename :
4405147
Link To Document :
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