DocumentCode :
2405393
Title :
Trends and challenges in VLSI technology scaling towards 100 nm
Author :
Rusu, Stefan ; Sachdev, Manoj ; Svensson, Christer ; Nauta, Bram
Author_Institution :
Intel Corp., USA
fYear :
2002
fDate :
2002
Firstpage :
16
Lastpage :
17
Abstract :
Summary form only given. Moore´s Law drives VLSI technology to continuous increases in transistor densities and higher clock frequencies. This tutorial will review the trends in VLSI technology scaling in the last few years and discuss the challenges facing process and circuit engineers in the 100nm generation and beyond. The first focus area is the process technology, including transistor scaling trends and research activities for the 100nm technology node and beyond. The transistor leakage and interconnect RC delays will continue to increase. The tutorial will review new circuit design techniques for emerging process technologies, including dual Vt transistors and silicon-on-insulator. It will also cover circuit and layout techniques to reduce clock distribution skew and jitter, model and reduce transistor leakage and improve the electrical performance of flip-chip packages. Finally, the tutorial will review the test challenges for the 100nm technology node due to increased clock frequency and power consumption (both active and passive) and present several potential solutions
Keywords :
VLSI; circuit CAD; clocks; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; jitter; leakage currents; low-power electronics; 100 nm; Moore´s Law; VLSI technology scaling; circuit design techniques; circuit engineers; clock distribution skew; clock frequencies; electrical performance; flip-chip packages; interconnect RC delays; jitter; power consumption; process engineers; process technology; research activities; silicon-on-insulator; transistor densities; transistor leakage; transistor scaling trends; Circuit synthesis; Clocks; Delay; Frequency; Integrated circuit interconnections; Jitter; Moore´s Law; Packaging; Silicon on insulator technology; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2002. Proceedings of ASP-DAC 2002. 7th Asia and South Pacific and the 15th International Conference on VLSI Design. Proceedings.
Conference_Location :
Bangalore
Print_ISBN :
0-7695-1441-3
Type :
conf
DOI :
10.1109/ASPDAC.2002.994875
Filename :
994875
Link To Document :
بازگشت