DocumentCode :
2405773
Title :
Hybrid optoelectronic backplane bus for multiprocessor-based computing systems
Author :
Zhao, Chunhe ; Jian Liu ; Chen, Ray T. ; Liu, Yung S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
fYear :
1996
fDate :
27-29 Oct 1996
Firstpage :
313
Lastpage :
320
Abstract :
The architecture of a hybrid electrical and optical backplane with multiple bus lines for high performance bus is proposed and bus systems with 2-bus lines at a wavelength of 850 nm are experimentally demonstrated, with a size of collimation lens (here we used graded index (GRIN) lenses) and level of collimation-limited separation of 1.5 mm between the two bus lines. For the new bus system containing multiple bus lines and 9 processor/memory boards, VCSELs (vertical cavity surface emitting lasers) and photodetector arrays, such parameters as power budget, misalignment and packaging related issues are discussed. With the introduction of GRIN lenses into the backplane system, it is found that not only can the signal beam from the VCSELs get collimated, but the angular tolerance of the system is greatly enhanced. The optical backplane bus system developed here is transparent to higher level bus protocols, thus can support standard backplane buses such as Futurebus +, Multi-bus II, and VMEbus
Keywords :
gradient index optics; laser cavity resonators; lenses; multiprocessor interconnection networks; optical collimators; optical computing; packaging; printed circuits; semiconductor laser arrays; surface emitting lasers; system buses; 1.5 mm; 850 nm; Futurebus+; GRIN lenses; Multi-bus II; PC board backplanes; VCSELs; VMEbus; angular tolerance; bus protocols; collimation lens; graded index lenses; high performance bus; hybrid optoelectronic backplane bus; multiple bus lines; multiprocessor interconnection networks; multiprocessor-based computing systems; optical backplane; packaging; photodetector arrays; power budget; signal beam; standard backplane buses; vertical cavity surface emitting lasers; Backplanes; Lenses; Optical arrays; Optical collimators; Optical surface waves; Packaging; Photodetectors; Power lasers; Surface emitting lasers; Vertical cavity surface emitting lasers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Massively Parallel Processing Using Optical Interconnections, 1996., Proceedings of the Third International Conference on
Conference_Location :
Maui, HI
Print_ISBN :
0-8186-7591-8
Type :
conf
DOI :
10.1109/MPPOI.1996.559115
Filename :
559115
Link To Document :
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