• DocumentCode
    2406128
  • Title

    High-temperature power performance of X-band recessed-gate AlGaN/GaN HEMTs

  • Author

    Lee, Cathy ; Saunier, Paul ; Tserng, Hua-Quen

  • Author_Institution
    TriQuint Semicond., Richardson, TX, USA
  • fYear
    2005
  • fDate
    30 Oct.-2 Nov. 2005
  • Firstpage
    157
  • Lastpage
    160
  • Abstract
    Record power densities have been demonstrated with AlGaN/GaN HEMTs using the field-modulating plate gate structure. This approach creates a trade-off between breakdown voltage and gain, which can be improved by performing gate recessing. In this work, 0.25-μm recessed-gate AlGaN/GaN devices were fabricated on SiC. At 10 GHz, saturated power density of 6.35 W/mm with peak PAE of 50.2% with assoc. gain of 13.2 dB at peak PAE at Vds = 35 V was achieved. Comparison of DC, small-signal, RF power, and high-temperature performance between recessed and non-recessed will be discussed.
  • Keywords
    III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; microwave transistors; wide band gap semiconductors; 0.25 micron; 10 GHz; 13.2 dB; 35 V; AlGaN-GaN; X-band recessed-gate; breakdown voltage; field-modulating plate gate structure; gate recessing; high electron mobility transistors; high-temperature power performance; saturated power density; Aluminum gallium nitride; Etching; Gallium nitride; HEMTs; MODFETs; Performance gain; Radio frequency; Silicon carbide; Temperature dependence; Transconductance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Compound Semiconductor Integrated Circuit Symposium, 2005. CSIC '05. IEEE
  • Print_ISBN
    0-7803-9250-7
  • Type

    conf

  • DOI
    10.1109/CSICS.2005.1531802
  • Filename
    1531802