DocumentCode
2406379
Title
Temperature stable thermoplastic microwave materials and copper laminates
Author
Walpita, L.M. ; Ahern, M. ; Chen, P. ; Goldberg, H. ; Weinberg, S. ; Zipp, C. ; Adams, G. ; Wong, Y.-H.
Author_Institution
Hoechst Res. & Technol., Summit, NJ, USA
fYear
1998
fDate
26-28 Oct 1998
Firstpage
93
Lastpage
96
Abstract
High dielectric constant materials are increasingly needed in microwave circuit miniaturization for outdoor and indoor wireless applications. In this presentation, temperature stable high dielectric constant thermoplastic polymer compositions and copper laminated sheets made from these compositions for wireless applications are introduced. The compositions are made by mixing suitable ceramics and polymers. The design, fabrication and properties of these compositions and some applications, including antennas and filters, are discussed. The effect of temperature on the resonance frequency of patch antennas made from the copper laminated high dielectric constant composite sheets are also discussed
Keywords
ceramics; copper; filled polymers; laminates; microstrip antennas; microwave antennas; microwave filters; microwave materials; permittivity; resonance; thermal stability; antennas; ceramic/polymer mixture; composition design; composition fabrication; composition properties; copper laminated high dielectric constant composite sheets; copper laminated sheets; copper laminates; filters; high dielectric constant materials; high dielectric constant thermoplastic polymer compositions; indoor wireless applications; microwave circuit miniaturization; outdoor wireless applications; patch antennas; resonance frequency; temperature effects; temperature stable thermoplastic microwave materials; wireless applications; Ceramics; Copper; Dielectric materials; Fabrication; Filters; High-K gate dielectrics; Microwave circuits; Polymers; Sheet materials; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.733861
Filename
733861
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