• DocumentCode
    2406379
  • Title

    Temperature stable thermoplastic microwave materials and copper laminates

  • Author

    Walpita, L.M. ; Ahern, M. ; Chen, P. ; Goldberg, H. ; Weinberg, S. ; Zipp, C. ; Adams, G. ; Wong, Y.-H.

  • Author_Institution
    Hoechst Res. & Technol., Summit, NJ, USA
  • fYear
    1998
  • fDate
    26-28 Oct 1998
  • Firstpage
    93
  • Lastpage
    96
  • Abstract
    High dielectric constant materials are increasingly needed in microwave circuit miniaturization for outdoor and indoor wireless applications. In this presentation, temperature stable high dielectric constant thermoplastic polymer compositions and copper laminated sheets made from these compositions for wireless applications are introduced. The compositions are made by mixing suitable ceramics and polymers. The design, fabrication and properties of these compositions and some applications, including antennas and filters, are discussed. The effect of temperature on the resonance frequency of patch antennas made from the copper laminated high dielectric constant composite sheets are also discussed
  • Keywords
    ceramics; copper; filled polymers; laminates; microstrip antennas; microwave antennas; microwave filters; microwave materials; permittivity; resonance; thermal stability; antennas; ceramic/polymer mixture; composition design; composition fabrication; composition properties; copper laminated high dielectric constant composite sheets; copper laminated sheets; copper laminates; filters; high dielectric constant materials; high dielectric constant thermoplastic polymer compositions; indoor wireless applications; microwave circuit miniaturization; outdoor wireless applications; patch antennas; resonance frequency; temperature effects; temperature stable thermoplastic microwave materials; wireless applications; Ceramics; Copper; Dielectric materials; Fabrication; Filters; High-K gate dielectrics; Microwave circuits; Polymers; Sheet materials; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
  • Conference_Location
    West Point, NY
  • Print_ISBN
    0-7803-4965-2
  • Type

    conf

  • DOI
    10.1109/EPEP.1998.733861
  • Filename
    733861