Title :
On De-Embedding Phase for High Speed Connectors
Author :
Morales, Aldo ; Agili, Sedig ; Gaddala, Shilpa
Author_Institution :
Electr. Eng. Program, Penn State Univ. at Harrisburg, Harrisburg, PA
Abstract :
The phase error problem in de-embedding is examined for board structures and devices under test (DUT). The main feature of this paper is the comparison between the S-parameter data for the embedded DUT and the data for a judiciously chosen reference situation. It is important to note that de-embedding the phase is essential in the design of high-speed connectors in consumer electronics hardware, especially in providing "swappable" models for high-end microprocessor-based applications.
Keywords :
S-parameters; integrated circuit testing; microprocessor chips; S-parameter data; consumer electronics hardware; deembedding phase; devices under test; high speed connectors; microprocessor-based applications; phase error problem; swappable models; Calibration; Connectors; Consumer electronics; Equivalent circuits; Frequency measurement; Hardware; Length measurement; Microstrip components; Phase measurement; Scattering parameters;
Conference_Titel :
Consumer Electronics, 2008. ICCE 2008. Digest of Technical Papers. International Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
978-1-4244-1458-1
Electronic_ISBN :
978-1-4244-1459-8
DOI :
10.1109/ICCE.2008.4588007
