DocumentCode
2406547
Title
A novel electrical performance analysis for leaded packages
Author
Jin, Zhang ; Ma, Jingyl ; Iyer, M.K. ; Ooi, Ban Leong ; Leong, Mook Seng
Author_Institution
Dept. of Electr. Eng., Nat. Univ. of Singapore, Singapore
fYear
1998
fDate
26-28 Oct 1998
Firstpage
101
Lastpage
104
Abstract
This paper presents a novel analysis of electrical performance in a 208 PQFP. S-parameters are used to model the package leads. Simultaneous switching noise (SSN) is analysed both in time and frequency domain. Higher frequency effects, such as resonance and reflection are also included in this simulation study
Keywords
S-parameters; circuit resonance; circuit simulation; electromagnetic wave reflection; frequency-domain analysis; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; plastic packaging; time-domain analysis; PQFP; S-parameters; electrical performance; electrical performance analysis; frequency domain analysis; high frequency effects; leaded packages; package lead model; reflection; resonance; simulation; simultaneous switching noise; time domain analysis; Circuit simulation; Crosstalk; Driver circuits; Frequency; Inductance; Integrated circuit noise; Packaging; Performance analysis; Resonance; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.733871
Filename
733871
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