Title :
Simulation and evaluation of ground bounce induced crosstalk in a mixed logic ball grid array substrate design
Author_Institution :
ChipPAC Inc., Chandler, AZ, USA
Abstract :
A concurrent engineering path between package design and electrical simulation software tools was utilized to rapidly evaluate digital ground bounce and resulting crosstalk on nearby analog conductors for a mixed logic ball grid array (BGA) substrate design. Generated boundary element and lumped equivalent circuit models are discussed along with signal integrity analysis results
Keywords :
ball grid arrays; boundary-elements methods; circuit simulation; concurrent engineering; crosstalk; equivalent circuits; integrated circuit design; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; mixed analogue-digital integrated circuits; software tools; analog conductors; boundary element circuit models; concurrent engineering; crosstalk; digital ground bounce; electrical simulation software tools; ground bounce induced crosstalk; lumped equivalent circuit models; mixed logic BGA substrate; mixed logic ball grid array substrate design; package design; signal integrity analysis; simulation; Circuit simulation; Concurrent engineering; Conductors; Crosstalk; Electronics packaging; Logic arrays; Logic design; Signal generators; Software packages; Software tools;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733874
