Title :
Modeling of the electrical performance of the power and ground supply for a PC microprocessor on a card
Author :
Fang, Jiayuan ; Herrell, Dennis ; Zhao, Jin ; Zhang, Jingping ; Chen, Raymond
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
The electrical characteristics of the power and ground supply of a PC microprocessor packaged in a ball grid array (BGA) package mounted on a card are studied by dynamic electromagnetic field analysis. The effects of decoupling capacitors of different types and at different locations are investigated to achieve the objectives of low power and ground impedance and no or insignificant resonances inside the package
Keywords :
ball grid arrays; capacitors; circuit resonance; electric impedance; electromagnetic fields; integrated circuit modelling; integrated circuit packaging; microprocessor chips; BGA package; PC microprocessor; PC microprocessor package; ball grid array; card-mounted microprocessor; decoupling capacitors; dynamic electromagnetic field analysis; electrical characteristics; electrical performance modelling; ground impedance; ground supply; package resonance; power impedance; power supply; Analytical models; Capacitors; Circuit simulation; Electromagnetic fields; Frequency; Impedance; Microprocessor chips; Packaging; Power supplies; Resonance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733886
