Title :
Electromagnetic interference through slots in packaging structures
Author :
Gentili, G. Biffi ; Gaggelli, A. ; Pelosi, G.
Author_Institution :
Dept. of Electron. Eng., Florence Univ., Italy
Abstract :
EMI through slots in packaging structures is analysed using a hybrid finite element method (FEM)/method of moments (MoM) procedure, which allows treatment of quite general structures. In particular, the effects of a slot on a metal plate and a metal wedge are compared
Keywords :
electromagnetic interference; finite element analysis; method of moments; packaging; EMI; electromagnetic interference; hybrid FEM/method of moments procedure; hybrid finite element method/method of moments procedure; metal plate; metal wedge; packaging structure slots; packaging structures; slots; Electromagnetic interference; Electronic equipment; Electronics packaging; Gaskets; Green´s function methods; Integrated circuit interconnections; Message-oriented middleware; Mutual coupling; Solid modeling; Surface reconstruction;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733927
