Title :
High frequency equivalent circuit model of via
Author :
Orhanovic, Neven
Author_Institution :
Interconnectix Bus. Unit, Mentor Graphics Corp., Wilsonville, OR, USA
Abstract :
A simple equivalent circuit model of a via valid for ps rise time signals is described. The proposed model is compared with three dimensional (3D) finite difference time domain (FDTD) simulations based on Yee´s discretization scheme
Keywords :
equivalent circuits; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit packaging; multichip modules; printed circuits; 3D FDTD simulations; 3D finite difference time domain simulations; MCM interconnects; PCB interconnects; Yee´s discretization scheme; equivalent circuit model; high frequency equivalent circuit model; rise time signal; via; Circuit simulation; Computational modeling; Equivalent circuits; Finite difference methods; Frequency; Integrated circuit interconnections; Nonhomogeneous media; Solid modeling; Time domain analysis; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733937
