Title :
Modeling of power distribution systems in PCs
Author :
Herrell, Dennis ; Beker, Benjamin
Author_Institution :
Adv. Micro Devices Inc., Austin, TX, USA
Abstract :
This paper presents an approximate technique for building a model and simulating the response of the power distribution system for high-performance microprocessors. A distributed equivalent circuit is obtained by extracting the appropriate RLCs using a combination of two- and three-dimensional quasi-static field solvers. The model includes the chip, its connection to the package, and the power distribution structure in the package, connector and motherboard. The response of the entire power system is treated as a 2nd order system, by which the performance of the power delivery network is assessed. Samples of transient and frequency domain data for typical microprocessors are given and the effects of some design options are discussed
Keywords :
driver circuits; electric connectors; equivalent circuits; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; microcomputers; microprocessor chips; printed circuit accessories; 2D quasi-static field solvers; 3D quasi-static field solvers; PC power distribution systems; PCs; RLC extraction; chip connection; connector; design options; distributed equivalent circuit; frequency domain data; microprocessors; modeling; motherboard; package; power delivery network performance; power distribution structure; power distribution system model; power distribution system response simulation; power system response; transient data; Buildings; Circuit simulation; Connectors; Equivalent circuits; Microprocessors; Packaging; Personal communication networks; Power distribution; Power system modeling; Power system transients;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733942
