Title :
Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination
Author_Institution :
SUN Microsyst. Inc., Chelmsford, MA, USA
Abstract :
Power and ground planes should exhibit low impedance over a wide range of frequencies. Parallel ground and power planes in multilayer printed-circuit boards exhibit multiple resonances which increase the impedance and also the radiation from the board edge. Resistive termination along the board edges reduces the resonance peaks. Simple and straightforward design expressions, simulated self and transfer impedances, and measured impedance and radiation plots are presented for a pair of 10" by 10" planes with 31 mil FR4 dielectrics
Keywords :
circuit noise; circuit resonance; circuit simulation; dielectric thin films; electric impedance; electromagnetic interference; printed circuit design; printed circuit testing; 10 in; 31 mil; EMI; FR4 dielectrics; board edge radiation; board edges; design expressions; dissipative edge termination; ground planes; ground/power planes; impedance; impedance plots; multilayer printed-circuit boards; multiple resonances; parallel ground/power planes; power planes; radiation plots; resistive termination; resonance peaks; simulated self-impedance; simulated transfer impedance; simultaneous switching noise; Capacitance; Dielectric losses; Frequency; Impedance; Inductance; Nonhomogeneous media; Power system transients; Propagation delay; Resonance; Silicon;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.733963
