DocumentCode :
2408479
Title :
Contribution of resonance to ground bounce in lossy thin film planes
Author :
Pannala, Sreemala ; Bandyopadhyay, Jaya ; Swaminathan, Madhavan ; Torres, Myra ; Smith, Larry ; Yuan, Xingchao ; Fitzgerald, Grez
Author_Institution :
Center for Packaging Res., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
1998
fDate :
26-28 Oct 1998
Firstpage :
185
Lastpage :
188
Abstract :
This paper discusses the pulse propagation effects on lossy thin film package planes. The ground bounce phenomena produced by the resonance on planes has been captured using a combination of modeling techniques and measurements. A macromodeling method has been used to explain the transient phenomena by using the dominant poles and residues of the system
Keywords :
circuit analysis computing; circuit resonance; losses; packaging; poles and zeros; transient analysis; dominant system poles; dominant system residues; ground bounce; ground bounce phenomena; lossy thin film package planes; lossy thin film planes; macromodeling method; measurements; modeling techniques; package plane resonance; pulse propagation effects; resonance; transient phenomena; Dielectric thin films; Frequency domain analysis; Frequency measurement; Packaging; Power system transients; Resonance; Sampling methods; Switching circuits; Time domain analysis; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
Type :
conf
DOI :
10.1109/EPEP.1998.733966
Filename :
733966
Link To Document :
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