• DocumentCode
    2408605
  • Title

    On the optimization of hierarchical redundancies including configuration nets and switches

  • Author

    Iden, Hans-Jürgen M.

  • Author_Institution
    Inst. fuer Theor. Elektrotech., Hannover Univ., West Germany
  • fYear
    1989
  • fDate
    3-5 Jan 1989
  • Firstpage
    173
  • Lastpage
    182
  • Abstract
    The optimization of hierarchical redundancies for large-area monolithic wafer-scale integration systems is discussed. Optimality is defined by a cost function, which accounts for yield as well as for area. On the basis of this cost function, the optimal implementation of redundancy for each part of a system is described analytically. Thus, the redundancy needed for a certain part of a system can be calculated simply instead of by doing a numerical multiparameter optimization for the whole system. For a subset of modules called `critical´, an exact solution is given. For the general case of a module in a hierarchy, an estimation is given. It has to be based on certain assumptions, which are related to the important influence of configuration nets and switches. Results calculated from the analytical description fit those obtained by a numerical optimization. The analytical descriptions give an insight into the properties of optimized redundant systems, their dependency on defect density, and their overhead, depending on system size
  • Keywords
    VLSI; monolithic integrated circuits; optimisation; redundancy; configuration nets; cost function; defect density; hierarchical redundancies; large-area monolithic wafer-scale integration systems; numerical multiparameter optimization; numerical optimization; optimal implementation; overhead; switches; system size; yield; Circuits; Cost function; Knowledge based systems; Minimization; Production; Semiconductor device modeling; Silicon; Switches; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-8186-9901-9
  • Type

    conf

  • DOI
    10.1109/WAFER.1989.47548
  • Filename
    47548