• DocumentCode
    2408720
  • Title

    Modeling of Electromagnetic Shielding Effectiveness of Multilayer Conducting Composites in the Microwave Band

  • Author

    Nhan, Hoang Ngoc ; Miane, J. ; Wojkiewicz, J.

  • Author_Institution
    Dep. Instrum. & Ind. Informatics, Hanoi Univ. of Technol., Vietnam
  • fYear
    2006
  • fDate
    10-11 Oct. 2006
  • Firstpage
    482
  • Lastpage
    485
  • Abstract
    In this paper, the characteristic matrix model is used to simulate the electromagnetic shielding effectiveness (SE) of multilayer electromagnetic shielding of polyaniline-polyurethane (Pani/PU) conducting composites in the microwave band. Electric and electromagnetic properties of freestanding and three-layered Pani/PU films are measured in X and Ku band by using two rectangular waveguides. The measured SE of these films agrees with theoretical values obtained from matrix model, is increases from some dB to 55dB depending the mass concentration of Pani in the blend with only about 150 mum thickness. The model permits to analyse the role of Pani in the blend and the effects of multilayer structure of Pani/PU.
  • Keywords
    composite materials; conducting polymers; electromagnetic shielding; polymer films; rectangular waveguides; Pani/PU conducting composites; characteristic matrix model; electric properties; electromagnetic properties; electromagnetic shielding effectiveness; microwave band; multilayer conducting composites; multilayer electromagnetic shielding; polyaniline-polyurethane; rectangular waveguides; three-layered Pani/PU films; Electric variables measurement; Electromagnetic measurements; Electromagnetic modeling; Electromagnetic scattering; Electromagnetic shielding; Electromagnetic waveguides; Microwave bands; Nonhomogeneous media; Rectangular waveguides; Transmission line matrix methods; characteristic matrix model; electromagnetic shielding effectiveness; multilayer structrure; polyaniline/polyurethane;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Electronics, 2006. ICCE '06. First International Conference on
  • Conference_Location
    Hanoi
  • Print_ISBN
    1-4244-0568-8
  • Electronic_ISBN
    1-4244-0569-6
  • Type

    conf

  • DOI
    10.1109/CCE.2006.350874
  • Filename
    4156525