Silicon solar cells using backside contacts with through-wafer interconnects

In this paper, a viable alternative design for silicon solar cells using backside contacts with through-wafer interconnects (TWI) is discussed. TWI technology allows conductive paths to be created without sacrificing top surface area. Using this technology, we were able to provide a connection from the top n-type material to the cathode at the rear of the solar cell. The potential advantages and the proposed design are also discussed