DocumentCode :
2408941
Title :
Power distribution for highly parallel WSI architectures
Author :
Johnstone, K.K. ; Butcher, J.B.
fYear :
1989
fDate :
3-5 Jan 1989
Firstpage :
203
Lastpage :
214
Abstract :
An investigation of the transient noise-coupled currents and their effect on voltage integrity is discussed. The investigation has been undertaken using an extracted-load simulation technique with a typical fine-grain systolic array-based architectures as the research vehicle. Simulation results indicate that potentially harmful power supply resonances of up to 40-ns duration can occur. Although these can be brought under control with peripheral decoupling components, serious problems associated with the maintenance of acceptable voltage integrity, with standard power distribution technology can occur when the device size is increased beyond 35-mm on a side. Although such sizes are significantly larger than current VLSI, they are clearly at least a factor or two less than monolithic WSI, thus suggesting that an alternative power distribution technology must be sought
Keywords :
VLSI; cellular arrays; power supply circuits; architectures; extracted-load simulation technique; fine-grain systolic array-based architectures; highly parallel; monolithic WSI; peripheral decoupling components; power distribution technology; power supply resonances; transient noise-coupled currents; voltage integrity; Circuit noise; Current supplies; Power distribution; Power supplies; Power systems; Resonance; Systolic arrays; Very large scale integration; Voltage; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1989. Proceedings., [1st] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9901-9
Type :
conf
DOI :
10.1109/WAFER.1989.47551
Filename :
47551
Link To Document :
بازگشت