Failure analysis enhancement by evaluating the Thermal Laser Stimulation impact on analog ICs

Technology advances in mixed-mode and analog ICs, involving multiple functions inside the device, make Failure Analysis (FA) difficult. Variation Mapping techniques based on Thermal Laser Stimulation (TLS [1],[2],[3]) have already proven their efficiency for the localization of a physical defect or design weakness. Their extension will play a key FA role but the impact of IR laser beam on the basic analog structures has to be better understood. In this paper we will make this necessary study based on simulations & experimentations. The results allow a better understanding of device activities under TLS to, finally, improve the failure localization process.