Title :
Humidity-induced semiconductor device electrical reliability failures: Mechanism and wafer-level risk evaluation/ electrical screening-test proposal
Author :
Jacob, P. ; Nicoletti, G.
Author_Institution :
EMPA Swiss Fed. Labs. for Mater. Testing & Reseach, Dubendorf
Abstract :
Automotive semiconductors are frequently exposed to humidity- if penetrating, a high-ohmic film at the chip surface connects pins to various voltage levels, if they arenpsilat pull up/down protected. Since latest integration combines different technologies/voltage levels, such films trigger destructive malfunctions. A wafer-level test, high ohmically short-circuiting all existing pins to first maximum, then minimum voltage, should eliminate such design-induced reliability risks.
Keywords :
automotive electronics; failure analysis; semiconductor device reliability; automotive semiconductors; electrical screening; high ohmically short-circuiting; high-ohmic film; semiconductor device electrical reliability failures; wafer-level risk evaluation; Circuit testing; Failure analysis; Humidity; Pins; Proposals; Protection; Semiconductor device reliability; Semiconductor devices; Semiconductor films; Voltage;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588151
