DocumentCode :
2409180
Title :
The impact of system impedance on the characterization of high power devices
Author :
Sheikh, Aamir ; Tasker, Paul J. ; Lees, Jonathan ; Benedikt, Johannes
Author_Institution :
Cardiff Univ., Cardiff
fYear :
2007
fDate :
9-12 Oct. 2007
Firstpage :
949
Lastpage :
952
Abstract :
This paper focuses on the extension of the successful application of current and voltage waveform engineering of on-wafer devices to power levels relevant to both handset and basestation markets. Effects on the measured waveforms caused by a 50Omega characteristic impedance of the measurement system are investigated showing a significant effect at the lower and crucially at higher harmonics, which is in contrast to the current school of thought. For the first time a waveform based analysis of packaging affects is presented, allowing the effects of the system´s higher harmonic impedances to be studied and considered in the context of de-embedding measured waveforms. Measured de-embedded waveforms are compared with simulated equivalents model and are found to be in good agreement.
Keywords :
impedance matching; power semiconductor devices; semiconductor device measurement; semiconductor device packaging; semiconductor device testing; characteristic impedance; current waveform engineering; de-embedded waveforms; high power devices characterization; higher harmonic impedances; measurement system; on-wafer devices; packaging affects; system impedance; voltage waveform engineering; waveform based analysis; Current measurement; High power amplifiers; Impedance measurement; Packaging; Power amplifiers; Power engineering and energy; Power generation; Power measurement; Time measurement; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2007. European
Conference_Location :
Munich
Print_ISBN :
978-2-87487-001-9
Type :
conf
DOI :
10.1109/EUMC.2007.4405351
Filename :
4405351
Link To Document :
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