Electrical modeling of a BGA package for microwave applications-a layer by layer approach

Author

Ito, Ryosuke ; Hongsmatip, Thongchai ; Jackson, Robert W.

Author_Institution

Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

237

Lastpage

240

Abstract

An electrical modeling procedure is described for ball grid arrays (BGA) to be used at microwave frequencies. A lumped element circuit model for interconnection is developed and verified by measurement. The model includes the effects of solder balls, the motherboard, and layer-to-layer transitions

Keywords

MMIC; assembling; ball grid arrays; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; soldering; BGA package; ball grid arrays; electrical modeling; electrical modeling procedure; interconnection model; layer-by-layer electrical modeling; layer-to-layer transition effects; lumped element circuit model; microwave applications; microwave frequencies; model verification measurements; motherboard effects; solder ball effects; Automotive engineering; Circuit testing; Coaxial components; Coplanar waveguides; Costs; Feeds; Integrated circuit interconnections; Millimeter wave technology; Packaging; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.734007

Filename

734007