Title :
Full wave analysis and development of circuit models for flip chip interconnects
Author :
Staiculescu, Daniela ; Liang, Hongwei ; Laskar, Joy ; Mather, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents a full electromagnetic wave analysis at bump interconnects in flip chip packages. From measurement and simulation, a simple and accurate lumped element model has been developed for such flip chip interconnects. Based on our analysis, we provide basic design guidelines for flip-chip operation to 20 GHz
Keywords :
circuit simulation; electromagnetic field theory; flip-chip devices; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microwave integrated circuits; 20 GHz; bump interconnects; circuit models; design guidelines; flip chip interconnects; flip chip package measurement; flip chip packages; flip-chip operation; full electromagnetic wave analysis; full wave analysis; lumped element model; simulation; Circuit simulation; Coplanar waveguides; Flip chip; Integrated circuit interconnections; Packaging; Performance analysis; Performance evaluation; Semiconductor device measurement; Testing; Transmission line measurements;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.734009
