• DocumentCode
    2409296
  • Title

    Investigation on the mechanism of the leakage failure between poly gate and contact in subnano technology

  • Author

    Wang, Q.F. ; Toh, S.L. ; Deng, Q. ; Tan, P.K. ; Li, K. ; Teong, J. ; Mai, Z.H. ; Lam, J.

  • Author_Institution
    Chartered Semicond. Mfg Ltd., Singapore
  • fYear
    2008
  • fDate
    7-11 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    With the shrinkage of the transistor dimensions, the spacing between the structures become smaller and smaller. However due to the intrinsic characteristic of the CMOS device, the reduction of the operating voltage is limited. The electrical field between different structures keeps on increasing with the shrinkage of the transistor dimensions. Furthermore, many new failure modes were observed with the scaling of semiconductor device. One of them is poly gate to contact leakage. In this paper, the mechanism of the leakage failure between poly gate and the contact in subnano CMOS technology was discussed.
  • Keywords
    CMOS integrated circuits; leakage currents; nanocontacts; semiconductor device models; CMOS device; leakage failure; semiconductor device; subnano technology contact; subnano technology poly gate; transistor dimensions; CMOS technology; Etching; Nanoscale devices; Nickel; Random access memory; Testing; Transistors; Virtual colonoscopy; Voltage; Wood industry;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2039-1
  • Electronic_ISBN
    978-1-4244-2040-7
  • Type

    conf

  • DOI
    10.1109/IPFA.2008.4588159
  • Filename
    4588159