DocumentCode
2409296
Title
Investigation on the mechanism of the leakage failure between poly gate and contact in subnano technology
Author
Wang, Q.F. ; Toh, S.L. ; Deng, Q. ; Tan, P.K. ; Li, K. ; Teong, J. ; Mai, Z.H. ; Lam, J.
Author_Institution
Chartered Semicond. Mfg Ltd., Singapore
fYear
2008
fDate
7-11 July 2008
Firstpage
1
Lastpage
4
Abstract
With the shrinkage of the transistor dimensions, the spacing between the structures become smaller and smaller. However due to the intrinsic characteristic of the CMOS device, the reduction of the operating voltage is limited. The electrical field between different structures keeps on increasing with the shrinkage of the transistor dimensions. Furthermore, many new failure modes were observed with the scaling of semiconductor device. One of them is poly gate to contact leakage. In this paper, the mechanism of the leakage failure between poly gate and the contact in subnano CMOS technology was discussed.
Keywords
CMOS integrated circuits; leakage currents; nanocontacts; semiconductor device models; CMOS device; leakage failure; semiconductor device; subnano technology contact; subnano technology poly gate; transistor dimensions; CMOS technology; Etching; Nanoscale devices; Nickel; Random access memory; Testing; Transistors; Virtual colonoscopy; Voltage; Wood industry;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location
Singapore
Print_ISBN
978-1-4244-2039-1
Electronic_ISBN
978-1-4244-2040-7
Type
conf
DOI
10.1109/IPFA.2008.4588159
Filename
4588159
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