Title :
Advanced localization technique of failures in packages / IO-stages of chips using Vector Network Analyser
Author :
Krueger, Bernd ; Pohl, Helmut ; Schumann, Fritz ; Schoemann, Stephan
Author_Institution :
Infineon Technol. AG, Munich
Abstract :
Current time domain reflectometry (TDR) equipment suffers from certain limitations [1]. These can be resolved by using a vector network analyser (VNA) system [2]. This paper will highlight the advances and drawbacks of using a VNA for the localization of failures within the signal path of packages or input-/output-stages of chips. Various examples will demonstrate the capabilities. Further improvements by using simulation tools may be possible.
Keywords :
failure analysis; network analysers; packaging; time-domain reflectometry; IO-stages; advanced localization; current time domain reflectometry; failure localization; input-stages; output-stages; package failures; vector network analyser; Bandwidth; Failure analysis; Frequency domain analysis; Instruments; Oscilloscopes; Packaging machines; Pulse generation; Reflectometry; Signal resolution; Testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588163
