Title :
Device-level fault isolation of advanced flip-chip devices using scanning SQUID microscopy
Author :
Teo, C.W. ; Lwin, H.E. ; Narang, V. ; Chin, J.M.
Author_Institution :
Adv. Micro Devices Singapore Pte Ltd., Singapore
Abstract :
This article describes how a scanning SQUID microscope (SSM) enhances the capability of device-level fault isolation on advanced 90 nm and 65 nm flip-chip microprocessor devices. SSM has proved to be very useful in isolating bump shorts and shorts in copper interconnects. For improved resolution and analyzing bumped dies, a front-side SSM technique is developed that has greatly increased success rates and analysis turn-around time. In this paper, we focus on die-level fault isolation on advanced microprocessor devices with numerous metal layers.
Keywords :
SQUIDs; fault location; flip-chip devices; integrated circuit interconnections; microprocessor chips; copper interconnects; die-level fault isolation; flip-chip devices; metal layers; microprocessor devices; scanning SQUID microscopy; size 65 nm; size 90 nm; Biomedical optical imaging; Copper; Current density; Failure analysis; Magnetic sensors; Microprocessors; Optical microscopy; Packaging; Pins; SQUIDs;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588164
