Title :
Case study of copper dendrite growth under HAST test
Author :
Kim, Sang-Ah ; Ahn, Do-Seok ; Eum, Yong-Hui ; Kim, Duck-Hyun ; Kim, Young-Bae
Author_Institution :
Failure Anal. Team, QRT Semicond., Ichon
Abstract :
The HAST is performed for the purpose of evaluating the reliability of nonhermetic packaged solid-state devices in humid environments. This paper discusses the issue of copper dendrite growth, electrochemical migration, memory fuse box and die edge areas under HAST test.
Keywords :
ball grid arrays; copper; dendrites; electromigration; environmental factors; semiconductor device reliability; semiconductor device testing; HAST test; copper dendrite growth; die edge; electrochemical migration; memory fuse box; nonhermetic packaged solid-state devices; Circuit testing; Copper; Failure analysis; Fuses; Humidity; Life estimation; Life testing; Moisture; Packaging; Temperature;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588167
