• DocumentCode
    2409533
  • Title

    Chaos analysis of the influence of tensile stress on electrochemical noise

  • Author

    Zhan, Jun ; Liu, Xiaofang ; Zhang, Qian ; Liu, Qingjie ; Long, Feng

  • Author_Institution
    Second Artillery Eng. Coll., Xi´´an, China
  • fYear
    2009
  • fDate
    15-16 May 2009
  • Firstpage
    418
  • Lastpage
    421
  • Abstract
    In this paper, chaos theory was used to analyze the influence of tensile stress on electrochemical noise about 7075-T76 aluminum alloy in 3.5%NaCl solutions. The result shows that the applied stress accelerated the formation of electric double-layer and the greater the stress, the shorter the formation time. Electrochemical noise data in the phase had strong linear autocorrelation whose largest Lyapunov exponents were negative. Electrochemical noise data was not chaotic. The greater the stress, the larger the largest LE and the steady trend. After the formation of electric double-layer, electrochemical noise data in the phase had weak linear autocorrelation. With the increasing of the stress, largest Lyapunov exponents were smaller whose range were (0 1). Electrochemical noise data had weak chaos and periodicity. Fractal dimension of electrochemical noise in the phase had the same change trend with largest Lyapunov exponents. The stress can lead to stabilization of electrochemical signals and decrease fluctuation.
  • Keywords
    Lyapunov methods; aluminium alloys; chaos; electrochemistry; materials testing; tensile strength; 7075-T76 aluminum alloy; Lyapunov exponents; chaos analysis; chaos theory; electrochemical noise; tensile stress; Aluminum alloys; Autocorrelation; Chaos; Corrosion; Fluctuations; Fractals; Noise shaping; Phase noise; Shape memory alloys; Tensile stress; chaos; corrosion; electrochemical noise; fractal dimension; largest lyapunov exponent; stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Mechatronics and Automation, 2009. ICIMA 2009. International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-3817-4
  • Type

    conf

  • DOI
    10.1109/ICIMA.2009.5156652
  • Filename
    5156652