Title :
Lid adhesive failure study for flip chip packaging
Author :
Ong, M.C. ; Zhao, X.L. ; Joman, P.P. ; Chin, J.M. ; Master, Raj N.
Author_Institution :
Device Anal. Lab., Adv. Micro Devices Pte Ltd., Singapore
Abstract :
This paper studied the factors of causing adhesion failure between lid and adhesive. Adhesive curing mechanism has been experimentally investigated in combination of surface behaviour analysis on lid by using FTIR and XPS. The results showed residue on lid surface caused by low water rinse flow can affect the curing condition.
Keywords :
X-ray photoelectron spectra; adhesive bonding; flip-chip devices; FTIR; XPS; adhesive curing mechanism; flip chip packaging; lid adhesive failure study; surface behaviour analysis; Adhesives; Bonding forces; Curing; Flanges; Flip chip; Heat sinks; Heat transfer; Packaging; Sealing materials; Thermal stresses;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588171
