• DocumentCode
    2409650
  • Title

    Application of conductive atomic force microscopy to study the in-line electrical defects

  • Author

    Toh, S.L. ; Deng, Q. ; Tang, W.T. ; Lim, V. ; Gn, F.H. ; Tan, P.K. ; Tan, H. ; Mai, Z.H. ; Lam, J.

  • Author_Institution
    Technol. Dev. Dept., Chartered Semicond. Mfg Ltd., Singapore
  • fYear
    2008
  • fDate
    7-11 July 2008
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Selection of optimized electron beam parameters for in-line monitoring is necessary to eliminate false signals. Application of electron beam to detect electrical defects, particularly leakages, for static random access memory (SRAM) cells poses a great challenge as it requires current measurement tool with nanometer resolution to complement it. By correlating the brightness intensity or the gray-level value to the measured current values, we have shown that conductive atomic force microscopy (C-AFM) can overcome this obstacle and can be used to verify the validity of the voltage contrast (VC) captured by HMI eScan3xx Ebeam inspection tool.
  • Keywords
    SRAM chips; atomic force microscopy; electron beams; inspection; HMI eScan3xx Ebeam inspection tool; SRAM cells; brightness intensity; conductive atomic force microscopy; gray-level value; in-line electrical defects; optimized electron beam; static random access memory cells; voltage contrast; Atomic force microscopy; Atomic measurements; Condition monitoring; Current measurement; Electron beams; Force measurement; Leak detection; Random access memory; SRAM chips; Signal resolution;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-2039-1
  • Electronic_ISBN
    978-1-4244-2040-7
  • Type

    conf

  • DOI
    10.1109/IPFA.2008.4588173
  • Filename
    4588173