DocumentCode :
2409650
Title :
Application of conductive atomic force microscopy to study the in-line electrical defects
Author :
Toh, S.L. ; Deng, Q. ; Tang, W.T. ; Lim, V. ; Gn, F.H. ; Tan, P.K. ; Tan, H. ; Mai, Z.H. ; Lam, J.
Author_Institution :
Technol. Dev. Dept., Chartered Semicond. Mfg Ltd., Singapore
fYear :
2008
fDate :
7-11 July 2008
Firstpage :
1
Lastpage :
4
Abstract :
Selection of optimized electron beam parameters for in-line monitoring is necessary to eliminate false signals. Application of electron beam to detect electrical defects, particularly leakages, for static random access memory (SRAM) cells poses a great challenge as it requires current measurement tool with nanometer resolution to complement it. By correlating the brightness intensity or the gray-level value to the measured current values, we have shown that conductive atomic force microscopy (C-AFM) can overcome this obstacle and can be used to verify the validity of the voltage contrast (VC) captured by HMI eScan3xx Ebeam inspection tool.
Keywords :
SRAM chips; atomic force microscopy; electron beams; inspection; HMI eScan3xx Ebeam inspection tool; SRAM cells; brightness intensity; conductive atomic force microscopy; gray-level value; in-line electrical defects; optimized electron beam; static random access memory cells; voltage contrast; Atomic force microscopy; Atomic measurements; Condition monitoring; Current measurement; Electron beams; Force measurement; Leak detection; Random access memory; SRAM chips; Signal resolution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
Type :
conf
DOI :
10.1109/IPFA.2008.4588173
Filename :
4588173
Link To Document :
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