DocumentCode
2409716
Title
A simple method for TEM sample preparation without carbon film background
Author
Lee, Meng-Lung ; Lin, Ren-De
Author_Institution
United Microelectron. Corp. (Singapore Branch), Ltd., Singapore
fYear
2008
fDate
7-11 July 2008
Firstpage
1
Lastpage
3
Abstract
The article describes a simple method to prepare TEM sample put on Cu grid without carbon support film. So that we could remove the background of carbon film while we do componential analysis.
Keywords
carbon; copper; transmission electron microscopy; C; Cu; TEM sample preparation; componential analysis; film background; Computer aided software engineering; Costs; Electrons; Energy loss; Microelectronics; Milling; Needles; Polymer films; Probes; Signal mapping;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location
Singapore
Print_ISBN
978-1-4244-2039-1
Electronic_ISBN
978-1-4244-2040-7
Type
conf
DOI
10.1109/IPFA.2008.4588176
Filename
4588176
Link To Document