DocumentCode
2409861
Title
A monolithic spiral transmission-line balun
Author
Yoon, Yeong J. ; Lu, Yicheng ; Frye, Robert C. ; Smith, Peter R.
Author_Institution
Dept. of Electr. & Comput. Eng., Rutgers Univ., Piscataway, NJ, USA
fYear
1998
fDate
26-28 Oct 1998
Firstpage
248
Lastpage
251
Abstract
We describe models and a design method for a circular spiral transmission-line balun and compare these with the measured results. The balun is fabricated using silicon thin-film MCM-D technology, and is suitable for integration in RF packages. It has a wide bandwidth and provides excellent balanced outputs in the frequency range of 1.6~3.2 GHz
Keywords
MMIC; baluns; elemental semiconductors; integrated circuit packaging; multichip modules; silicon; waveguide components; 1.6 to 3.2 GHz; RF package integration; Si; balanced outputs; balun; bandwidth; circular spiral transmission-line balun; design method; frequency range; models; monolithic spiral transmission-line balun; silicon thin-film MCM-D technology; Coaxial components; Design methodology; Energy consumption; Impedance matching; Radio frequency; Silicon; Spirals; Transformers; Transmission lines; Wireless communication;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.734035
Filename
734035
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