DocumentCode
2409938
Title
The application of the TLM method to the simulation of high-speed and high-complexity electronic systems
Author
Christopoulos, Christos ; Vukovic, Ana
Author_Institution
Numerical Modelling Lab., Nottingham Univ., UK
fYear
1998
fDate
26-28 Oct 1998
Firstpage
259
Lastpage
263
Abstract
The paper describes the current state of time-domain simulation methods, with an emphasis on transmission line modelling (TLM), and their application to problems in electronic circuit interconnection and packaging. Illustrative results from simulations are also presented
Keywords
circuit simulation; integrated circuit design; integrated circuit interconnections; integrated circuit packaging; time-domain analysis; transmission line theory; TLM method; electronic circuit interconnection; electronic circuit packaging; high-complexity electronic systems; high-speed electronic systems; simulation; time-domain simulation methods; transmission line modelling; Circuit simulation; Electronic circuits; Electronics packaging; Finite difference methods; Frequency; Integrated circuit interconnections; Resonance; Shape control; Spatial resolution; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.734039
Filename
734039
Link To Document