DocumentCode
2410047
Title
Canonical package problem solved using six different codes
Author
Rubin, Barry J.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
1998
fDate
26-28 Oct 1998
Firstpage
267
Lastpage
270
Abstract
A major difficulty faced by package engineers in solving package problems is the reconciliation of results generated from multiple analysis techniques. Consider a signal integrity analysis of a net using 2D codes to characterize the long signal line (transmission line) portions and 3D LC or full-wave codes to characterize the discontinuity portions. Since the discontinuity must be modeled with an attached section of signal line to properly reflect the surroundings, an inconsistency results if these codes yield different results for the signal line portion. In this paper, we demonstrate a suite of tools and a package analysis methodology that provides the user with the consistency in results needed to assure correct subsequent simulation. A package structure involving two signal lines situated between a pair of mesh reference planes is solved using six different techniques ranging from static 2D to static 3D to full-wave 3D. The analysis methodology and code formulation are shown to yield results that closely agree between the approaches
Keywords
circuit analysis computing; packaging; software tools; 2D codes; 3D LC codes; analysis methodology; analysis tool suite; canonical package problem; code formulation; discontinuity model; discontinuity portions; full-wave 3D analysis; full-wave codes; long signal line portions; mesh reference planes; multiple analysis techniques; package analysis methodology; package structure; signal integrity analysis; signal line; signal line portion; signal lines; simulation; static 2D analysis; static 3D analysis; transmission line portions; Analytical models; Capacitance; Conductors; Frequency; Green function; Inductance; Notice of Violation; Packaging; Signal analysis; Surface resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location
West Point, NY
Print_ISBN
0-7803-4965-2
Type
conf
DOI
10.1109/EPEP.1998.734045
Filename
734045
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