Efficient computation of interconnect capacitances using the domain decomposition approach

Author

Veremey, Vladimir ; Mittra, Raj

Author_Institution

Electromagn. Commun. Res. Lab., Pennsylvania State Univ., University Park, PA, USA

fYear

1998

fDate

26-28 Oct 1998

Firstpage

277

Lastpage

280

Abstract

A novel technique based on the use of the finite difference (FD) method, applied in conjunction with the perfectly matched layer (PML) and impedance boundary conditions for mesh truncation, is combined with the domain decomposition approach to compute the capacitance matrices of complex interconnect configurations in an efficient manner. Both the overlapping and nonoverlapping domain approaches are employed to model the interconnects, and convergence and efficiency issues of the proposed algorithms are examined

Keywords

capacitance; convergence of numerical methods; electric impedance; finite difference methods; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; matrix algebra; algorithm convergence; algorithm efficiency; capacitance matrices; computation efficiency; domain decomposition approach; finite difference method; impedance boundary condition; interconnect capacitance; interconnect configurations; interconnect modelling; mesh truncation; nonoverlapping domain approach; overlapping domain approach; perfectly matched layer condition; Boundary conditions; Capacitance; Central Processing Unit; Concurrent computing; Convergence; Dielectrics; Finite difference methods; Impedance; Perfectly matched layers; Tensile stress;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on

Conference_Location

West Point, NY

Print_ISBN

0-7803-4965-2

Type

conf

DOI

10.1109/EPEP.1998.734050

Filename

734050