Title :
Recent improvements for fast inductance extraction and simulation [packaging]
Author :
Kamon, Mattan ; Wang, Frank ; White, Jacob
Author_Institution :
Microcosm Technol. Inc., Cambridge, MA, USA
Abstract :
This paper first describes generation of nearly optimal compact SPICE-type models which accurately capture the frequency dependence of the resistance and inductance of 3D conductor geometries. Secondly, it describes an approach to rapidly generate the mutual and self-inductance of generally shaped six-sided partial element equivalent circuit (PEEC) elements
Keywords :
SPICE; circuit analysis computing; electric resistance; equivalent circuits; inductance; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; 3D conductor geometries; PEEC elements; circuit element shape; frequency dependence; inductance; inductance extraction; inductance simulation; mutual inductance; optimal compact SPICE-type models; packaging; partial element equivalent circuit elements; resistance; self-inductance; Circuit simulation; Computational modeling; Conductors; Coupling circuits; Equivalent circuits; Inductance; Integrated circuit interconnections; Micromechanical devices; Packaging; Sparse matrices;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on
Conference_Location :
West Point, NY
Print_ISBN :
0-7803-4965-2
DOI :
10.1109/EPEP.1998.734053
