Title :
Failure analysis matrix of light emitting diodes for general lighting applications
Author_Institution :
Korea Photonics Technol. Inst., Gwangju
Abstract :
Failure mechanisms of light emitting diodes (LEDs) have been investigated. Various failure patterns of LEDs for general lighting applications were simulated under high electrical and thermal stress test conditions. Using scanning electron microscopy related with I-V characterization before and after the stress simulation, a representative failure pattern of LEDs matrixed in terms of the electrical parameter shifts and physical conditions observed after decapsulation. By applying photo-emission microscopy it was found that local damage of LED surface was caused by excessive high temperature in the area of the pn junction of LEDs.
Keywords :
LED lamps; failure analysis; scanning electron microscopy; electrical stress test; failure analysis matrix; general lighting; light emitting diodes; photo-emission microscopy; scanning electron microscopy; thermal stress test; Electrostatic discharge; Failure analysis; LED lamps; Light emitting diodes; Semiconductor device testing; Solid state lighting; Temperature; Thermal degradation; Thermal stresses; Voltage;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the
Conference_Location :
Singapore
Print_ISBN :
978-1-4244-2039-1
Electronic_ISBN :
978-1-4244-2040-7
DOI :
10.1109/IPFA.2008.4588215
